摘要: 以甲基和苯基氯硅烷为单体 ,采用水解缩聚的方法合成有机硅树脂 ,并对影响有机硅树脂合成的有关因素进行了研究。结果表明,当水解温度为70 ℃ ,控制水用量 n(H2O):n(Cl)在8:1-5:1的范围内时,可合成出易溶于甲苯的有机硅树 脂。红外光谱（IR)显示,合成的硅树脂含有端经基。采用热失重法 (TG)、热失重的微分曲线法（DTG)和马弗炉烧蚀试验研究有机硅树脂耐的热性能和室温固化性能,并对KH-Cl和三乙醇胺两种室温固化剂对硅树脂的耐热性能的影响进行了对比研究。结果表明,在氩气气氛下 ,硅树脂具有很高的耐热性能，它的起始分解温度为400℃ ,热失重主要由 400 - 500 ℃ 时“解扣式”降解和500 ℃之后的“重排”降解引起。但在空气气氛下 ,由于有机基团的氧化分解,硅树脂的耐热性有所下降。KH-Cl可硅树脂在室温条件下固化 ,固化后硅树脂的耐热性能提高。
关键词 ：甲基苯基有机硅树脂 耐高温 端经基 室温 固化 热降解
Abstract: The methyl and phenyl chlorosilane monomer, was synthesized by hydrolysis and condensation of the silicone resin, silicone resin and the synthesis of the relevant factors were studied.
The results show that when the hydrolysis temperature is 70 ℃, control water consumption n (H2O): n (Cl) in the 8:1-5:1 range, it can synthesize soluble silicone resin in toluene.
Infrared spectroscopy (IR) showed that the synthesis of terminal hydroxyl containing silicone.The results show that argon atmosphere, silicon resin, high heat resistance, and its initial decomposition temperature is 400 ℃, weight loss primarily by 400 - 500 ℃ when the "Solution button" after the degradation and 500 ℃ " rearrangement "degradation caused.
However, in air atmosphere, due to the oxidation decomposition of organic groups, silicon resin, heat resistance decreased.
KH-Cl silicone resin can be cured at room temperature, cured silicone resins enhance heat resistance.
Key words: methyl-phenyl silicone resin-based curing at room temperature by high-temperature end of thermal degradation